Honor X5 Plus vs Xiaomi Redmi 13

Genel bakış

Marka: Honor; Xiaomi
Çıkış tarihi: Ekim 2023, 2 yıl 8 ay önce; Mayıs 2024, 2 yıl 1 ay önce
AnTuTu: 127.000 Antutu v9 Overall performance better than 53% of devices; 269.266 Antutu v10 Overall performance better than 60% of devices

Boyut: 6.56"; 6.79"
Çözünürlük: 720 x 1612 px HD+; 1080 x 2400 px FHD+
Tür: LCD IPS; LTPS LCD
Yoğunluk: 269 ppi Medium Density; 388 ppi High Density
En/boy oranı: 20:9; 19.5:9
Özellikler: Water Drop Notch, Refresh rate 90 Hz, TÜV Rheinland Eye Comfort Certification, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Hole-punch Notch, SGS Certified, Refresh rate 90 Hz, Scratch resistant, 2.5D curved glass glass, Capacitive, Multi-touch, Frameless

Çözünürlük: 50 Mpx; 108 Mpx
Diyafram: ƒ/ 1.8; ƒ/ 1.8
Flaş: LED; Quad LED
Optik sabitleme: No; No
Ağır çekim: No, 30 fps; Yes, 120 fps
Özellikler: Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Contrast detection autofocus (CDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Kapasite: 5200 mAh; 5030 mAh
Tür: Li-Polymer; Li-Polymer
Hızlı şarj: Yes , 10.0W; Yes , 33.0W
Özellikler: Reverse charging, Non-removable; Reverse charging, Non-removable

Kapasite: 64 GB; 128 GB
SD yuvası: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tür: —; eMMC 5.1 Storage

Boyutlar: 75.1 mm 163.3 mm 8.4 mm Print 3D Model; 76.3 mm 168.6 mm 8.2 mm Print 3D Model
Ağırlık: 188 g; 198 g
Malzemeler: Plastic; Plastic , P2i Nano coating , Splash resistant design
Renkler: Black Cyan Green; Black Pink Cyan
Kullanılabilir alan: 84 %; 94 %

İşletim sistemi: Android 13 Tiramisu Android 13; Android 14 Upside-down cake HyperOS (Android 14)
Google hizmetleri: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1 LELow energy consumption; Bluetooth 5.4 LELow energy consumption
Bluetooth profilleri: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi özellikleri: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB özellikleri: Charging, OTG; Charging, OTG
Navigasyon: GPS, A-GPS, GLONASS, Beidou; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B5 (850), B8 (900); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)