hisense A9 Pro vs Ulefone Armor 22

Genel bakış

Marka: HiSense; Ulefone
Çıkış tarihi: Mart 2023, 3 yıl 3 ay önce; Ağustos 2023, 2 yıl 10 ay önce
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 302.000 Antutu v9 Overall performance better than 61% of devices

Boyut: 6.1"; 6.58"
Çözünürlük: 824 x 1648 px FHD; 1080 x 2408 px FHD+
Tür: eInk E INK Carta 1200; LCD IPS
Yoğunluk: 302 ppi High Density; 401 ppi Very high density
En/boy oranı: 18:9; 20:9
Özellikler: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Refresh rate 120 Hz, Scratch resistant, Capacitive, Multi-touch, Oleophobic coating

Yonga seti: Qualcomm Snapdragon 662; MediaTek Helio G96
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x Cortex A76 2.05 GHz + 6x Cortex A55 2.0 GHz
CPU türü: Octa-Core; Octa-Core
Üretim süreci: 11 nm; 12 nm
Frekans: 2 GHz; 2.05 GHz
GPU: Qualcomm Adreno 610; ARM Mali-G57 MC2 900MHz
RAM: 8 GB; 8 GB
64-bit: Yes; Yes
RAM türü: —; LPDDR4X RAM

Çözünürlük: 13 Mpx; 64 Mpx
Diyafram: Unknow; ƒ/ 1.89
Flaş: LED; LED
Optik sabitleme: No; No
Ağır çekim: No, 30 fps; No, 30 fps
Özellikler: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Night Mode, Night Vision
Sensör: —; Sony IMX686 Exmor RS
Piksel boyutu: —; 0.80 µm
Sensör boyutu: —; 1/1.7"

Kapasite: 256 GB; 128 GB
SD yuvası: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tür: —; UFS Storage 2.1

Boyutlar: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 84.9 mm 176.8 mm 15.0 mm Print 3D Model
Ağırlık: 183 g; 324 g
Malzemeler: Plastic; Rugged Smartphone, Polycarbonate
Renkler: Black; Black Green
Kullanılabilir alan: 76 %; 69 %
Su/toz dayanımı: —; IP68, IP69 , MIL-STD-810H
Düşme dayanımı: —; Class A B C D E 270 drops without defects
Onarılabilirlik: —; Class A B C D E

İşletim sistemi: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Google hizmetleri: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.2 LELow energy consumption
Bluetooth profilleri: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi özellikleri: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB özellikleri: Charging, OTG; Charging, OTG
Navigasyon: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)