hisense A9 Pro vs hotwav T7S

Genel bakış

Marka: HiSense; Hotwav
Çıkış tarihi: Mart 2023, 3 yıl 3 ay önce; Ocak 2025, 1 yıl 5 ay önce
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Boyut: 6.1"; 6.52"
Çözünürlük: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Tür: eInk E INK Carta 1200; LCD IPS
Yoğunluk: 302 ppi High Density; 407 ppi Very high density
En/boy oranı: 18:9; 21:9
Özellikler: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch

Yonga seti: Qualcomm Snapdragon 662; MediaTek MT8788V
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
CPU türü: Octa-Core; Octa-Core
Üretim süreci: 11 nm; 12 nm
Frekans: 2 GHz; 2 GHz
GPU: Qualcomm Adreno 610; Mali-G72 MP3
RAM: 8 GB; 4 GB
64-bit: Yes; Yes
RAM türü: —; LPDDR4X RAM

Çözünürlük: 13 Mpx; 21 Mpx
Diyafram: Unknow; Unknow
Flaş: LED; LED
Optik sabitleme: No; No
Ağır çekim: No, 30 fps; No, 30 fps
Özellikler: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensör: —; Sony Exmor

Kapasite: 256 GB; 128 GB
SD yuvası: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tür: —; eMMC 5.1 Storage

Boyutlar: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Ağırlık: 183 g; 310 g
Malzemeler: Plastic; Rugged Smartphone, Plastic , Faux leather
Renkler: Black; Black Green
Kullanılabilir alan: 76 %; 71 %
Su/toz dayanımı: —; IP68, IP69 , MIL-STD-810H
Düşme dayanımı: —; Class A B C D E 270 drops without defects
Onarılabilirlik: —; Class A B C D E

İşletim sistemi: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Google hizmetleri: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Bluetooth profilleri: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi özellikleri: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB özellikleri: Charging, OTG; Charging, OTG
Navigasyon: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)