hisense A9 Pro vs hotwav Cyber X

Genel bakış

Marka: HiSense; Hotwav
Çıkış tarihi: Mart 2023, 3 yıl 2 ay önce; Temmuz 2023, 2 yıl 10 ay önce
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 415.300 Antutu v10 Overall performance better than 68% of devices

Boyut: 6.1"; 6.78"
Çözünürlük: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Tür: eInk E INK Carta 1200; LCD IPS
Yoğunluk: 302 ppi High Density; 396 ppi High Density
En/boy oranı: 18:9; 21:9
Özellikler: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch

Yonga seti: Qualcomm Snapdragon 662; MediaTek Helio G99 (MT6789)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
CPU türü: Octa-Core; Octa-Core
Üretim süreci: 11 nm; 6 nm
Frekans: 2 GHz; 2.2 GHz
GPU: Qualcomm Adreno 610; Mali-G57 MC2
RAM: 8 GB; 8 GB
64-bit: Yes; Yes
RAM türü: —; LPDDR4X RAM

Çözünürlük: 13 Mpx; 64 Mpx
Diyafram: Unknow; Unknow
Flaş: LED; Dual LED
Optik sabitleme: No; No
Ağır çekim: No, 30 fps; No, 30 fps
Özellikler: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensör: —; Sony IMX686 Exmor RS
Piksel boyutu: —; 0.80 µm
Sensör boyutu: —; 1/1.7"

Kapasite: 256 GB; 256 GB
SD yuvası: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Boyutlar: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 85.1 mm 181.8 mm 17.5 mm Print 3D Model
Ağırlık: 183 g; 380 g
Malzemeler: Plastic; TPU , Rugged Smartphone
Renkler: Black; Black
Kullanılabilir alan: 76 %; 70 %
Su/toz dayanımı: —; IP68, MIL-STD-810G , IP69

İşletim sistemi: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Google hizmetleri: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0
Bluetooth profilleri: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi özellikleri: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB özellikleri: Charging, OTG; Charging, OTG
Navigasyon: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)